Basic Info.
Model NO.
Sn99Ag0.3Cu0.7
Package
500g/Bottle
Alloy
Customized
Logo
OEM or ODM
Transport Package
Customized
Specification
250g 500g 1000g
Trademark
customized
Origin
China
HS Code
8001202900
Production Capacity
6000 Tons
Product Description
Product Specification
Type | Ingredient (WT%) | Melting point(ºC) | Application scenario |
Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
Sn62.6Pb37Ag0.4 | 183-190 | ||
Sn60Pb40 | 183-203 | ||
Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
Sn50Pb50 | 183-227 | ||
Sn45Pb55 | 183-238 | ||
Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding | |
Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys | |
Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder | |
Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |
Lead-Free solder wire
Tin-lead solder wire
Solder paste
Solder bar
Other solder products
Company Certification
Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.
Company Exhibition
Packing & Delivery
Packing Details : 500g/bottle,20bottle/box.
Delivery Details : Usually 3-5 days for samples and 10-20 days for bulk orders.
FAQ: